Renowned Industry Analyst to Host Special Session

LOVELAND, Colo., February 7, 2011 – Longview Advisors, organizers of the annual 3D Collaboration & Interoperability Congress (CIC), today announced a new, special forum for executive management in conjunction with the 2011 event, to be held May 23 to 25 in Denver, Colorado (www.3dcic.com). The new Management Forum will cover topics of particular interest to executives managing processes and people for more effective global collaboration in product development and manufacturing. The following topics are currently on the agenda for this year’s forum:

• Teamwork, Social Computing and Their Impact on Simulation Driven Design?
• Managing the Braindrain Threat from Boomer Retirement
• Irreconcilable Differences? Getting Engineers from Different Generations To Work Together
• Mashups: A Killer App for Engineers?
• Is PDM-Less PLM Pragmatic or Problematic?

Comprehensive Digital Enterprise Definition and Infrastructure Update

LOVELAND, Colo., April 11, 2011 – Longview Advisors, organizers of the annual 3D Collaboration & Interoperability Congress (CIC), today announced a special workshop focusing on the Model-Based Enterprise (MBE) as part of the 2011 event, to be held May 23 to 25 in Denver, Colorado (www.3dcic.com). The workshop will cover topics of particular interest to engineering and IT managers who may be planning or implementing processes to drive a digital MBE/MBD vision for more effective global collaboration in product development and manufacturing.

The MBE workshop will be kicked off by Sanjay Parimi, ARDEC Project Officer, Materials, Manufacturing & Prototype Technology U.S. ARMY, ARDEC. Mr. Parimi’s presentation, “Unlocking Native 3D CAD and MBD Assets For Use in Downstream Interactive 3DPDF Manufacturing Documents,” will discuss reuse of 3D CAD and embedded Model-Based Definition (MBD) data in downstream manufacturing processes. The following additional topics also will be presented in this year’s MBE Workshop:

Early-registration discounts now available

LOVELAND, Colo., January 31, 2011 – Longview Advisors, organizers of the annual 3D Collaboration & Interoperability Congress (CIC), today announced that registration is open for the 2011 event to be held May 23 to 25 in Denver, Colorado. Software, engineering, manufacturing and IT professionals are welcome to register at www.3DCIC.com. Time-limited early registration discounts currently apply.

Now in its eighth year, the annual CIC brings together experts and executives from a wide range of discrete manufacturing industries, as well as representatives from government and defense communities, to discuss the latest issues and solutions in collaboration and interoperability in global business. The three-day international meeting provides a world-class forum for exploring strategies, opportunities and solutions for improving innovation in such areas as global product development, manufacturing, logistics and support.

Event welcomes presentations from engineering and manufacturing community

LOVELAND, Colo., November 15, 2010 – Longview Advisors, organizers of the annual Collaboration & Interoperability Congress (CIC), today announced its official call for speakers for its 2011 event (www.3dcic.com) to be held May 23 to 25, 2011 in Denver, Colorado.

Now in its seventh year, the annual CIC brings together experts and executives from a wide range of discrete manufacturing industries, as well as representatives from government and defense communities, to discuss the latest issues in collaboration and interoperability. The three-day meeting of international professionals explores the current challenges and opportunities of sharing design data and bridging the divides within the product development process.

Dick Morley to Give Manufacturers a View into a ‘Factory Floor of Innovation’

LOVELAND, Colo., November 1, 2010 – Longview Advisors, organizers of the annual Collaboration & Interoperability Congress (CIC), announced today its keynote speaker for its 2011 event (www.3Dcic.com) to be held May 23-25, 2011 in Denver, Colorado.

Dick Morley is father of the Programmable Logic Controller (PLC), inventor of the floppy disk, a venture capitalist, and a renowned thinker, speaker, and author. He will give the keynote address to kick off the 2011 annual CIC event. His keynote will dovetail with the three-day event, covering current challenges and solutions in product development and design collaboration.

Morley is a director of innovation at Cyon Research, an independent think tank serving the engineering software community. Morley is a visionary and an entrepreneur in advanced technological developments holding more than 20 patents. His contributions have been acknowledged with numerous awards from groups such as Inc. Magazine, the Franklin Institute, the Society of Manufacturing Engineers, the Engineering Society of Detroit, and induction into the Manufacturing Hall of Fame. His latest book, Techshock: Caution: Future Under Repair, is typical of his unusual approach to problems, as is his venture into manufacturing chocolate with lessons learned from nanotechnology.

LOVELAND, Colo., September 28, 2010 – Longview Advisors, organizers of the annual Collaboration & Interoperability Congress (CIC), is proud to announce the 2011 event, which will be held May 23-25 in Denver, Colorado at the Inverness Hotel and Conference Center.

Registration is now open and encouraged for those dedicated to fostering and enhancing collaboration and interoperability in manufacturing. Visit the web site, www.3DCIC.com, to register or to learn more about the event.

There is still time to register for the Collaboration and Interoperability Congress, May 3 – 5, 2010

Milford, OH, March 15, 2010 – ITI TranscenData announced today that it is sponsoring the Collaboration and Interoperability Congress (CIC), being organized by Longview Advisors in Estes Park, CO May 3 – 5, 2010.  CIC brings together experts and executives from a wide range of discrete manufacturing industries, as well as representatives from government and defense communities, to discuss the latest issues in collaboration and interoperability. The meeting of international professionals explores the current challenges and opportunities of sharing design data and bridging the divides within the product development process.

“ITI TranscenData has supported CIC since its inception six years ago. We appreciate the value this forum brings to companies seeking solutions for the costly and time consuming challenges associated with data interoperability.” said ITI TranscenData President, Don Hemmelgarn. This year ITI TranscenData will go a step further by offering CIC attendees the additional value of a CATIA V4 to CATIA V5 Workshop.  This specific area of CAD Interoperability is one of the largest issues facing OEM’s and suppliers due to the impending sundown of the legacy V4 format.

320,000+ member ConnectPress to sponsor 2010 3D Collaboration & Interoperability Congress

Loveland, CO March 12, 2010– The organizers of the 2010 3D Collaboration & Interoperability Congress are pleased to announce ConnectPress as a Premier Publication Sponsor for this year’s conference taking place May 3-5, 2010 in Estes Park, CO.

“We are thrilled that ConnectPress will be taking part in the 3D Collaboration & Interoperability Congress as a key publication sponsor,” said David Prawel, president and principal consultant, Longview Advisors. “Its collection of CAD communities offer an unparalleled resource for CAD users and managers around the world, and we look forward to them being a part of this year’s event.”

ConnectPress produces specialized CAD and technology-based websites and newsletters, which  include Industry Features, Q & A and Tips & Tricks. With over 320,000 members, the ConnectPress collection of CAD communities is the leading provider of CAD brand specific web content.

Early-registration discounts now available

LOVELAND, Colo., January 27, 2010 – Longview Advisors, organizers of the annual Collaboration & Interoperability Congress (CIC), today announced that registration is open for the 2010 event to be held May 3 to 5 in Estes Park, Colorado. Software, engineering, manufacturing and IT professionals are welcome to register at: www.3DCIC.com. Time-limited early registration discounts currently apply.

Now in its sixth year, the annual CIC brings together experts and executives from a wide range of discrete manufacturing industries, as well as representatives from government and defense communities, to discuss the latest issues and solutions in collaboration and interoperability. The three-day meeting of international professionals provides a world-class forum for exploring current challenges and opportunities for improving innovation in global product development.

Experts from GE, Boeing, Ford Motor Company, Gulfstream Aerospace and the U.S. Army Highlight Speaker Lineup

LOVELAND, Colo., January 19, 2010 – Longview Advisors, organizers of the annual Collaboration & Interoperability Congress (CIC), today announced agenda topics and featured speakers for the 2010 event (www.3Dcic.com) to be held May 3 to 5 in Estes Park, Colorado.

Now in its sixth year, the annual CIC brings together experts and executives from a wide range of discrete manufacturing industries, as well as representatives from government and defense communities, to discuss the latest issues and solutions in collaboration and interoperability. The three-day meeting of international professionals provides a world-class forum for exploring current challenges and opportunities for improving innovation in global product development.

Along with four teams of industry experts in highly interactive, attendee-driven panel discussions, the 2010 CIC will include the following main topics:
* Digital Product Data Deployment Beyond Engineering
* Data Migration & Legacy Data Management
* STEP and Standards-based Solutions
* CAD Interoperability with Analysis/Simulation and Manufacturing
* PDM Processes & Lessons Learned
* PLCS for Engineering and Logistics Interoperability
* Interoperability & Collaboration Technology
* Architecting the Optimum Collaboration & Interoperability Environment

Event welcomes presentations from engineering and manufacturing community

LOVELAND, Colo., November 30, 2009 – Longview Advisors, organizers of the annual Collaboration & Interoperability Congress (CIC), today announced its official call for speakers for the 2010 event (www.3dcic.com) to be held May 3 to 5 in Estes Park, Colorado.

Now in its sixth year, the annual CIC brings together experts and executives from a wide range of discrete manufacturing industries, as well as representatives from government and defense communities, to discuss the latest issues in collaboration and interoperability.  The two-day meeting of international professionals explores the current challenges and opportunities of sharing design data and bridging the divides within the product development process.

Terry Wohlers to Give Manufacturers a Look to the Future

LOVELAND, Colo., November 2, 2009 – Longview Advisors, organizers of the annual 3D Collaboration & Interoperability Congress (CIC), announced today its keynote speaker for the 2010 event (www.3Dcic.com) to be held May 15-18 in Estes Park, Colorado.

Terry Wohlers, renowned industry consultant, speaker and author, will give the keynote address to kick off the sixth annual conference, a two-day event covering current challenges and solutions in product development and design collaboration.

Wohlers is principal consultant and president of Wohlers Associates, Inc., an independent consulting firm he founded 23 years ago. Through this company, Wohlers has provided consulting assistance to more than 150 organizations in 21 countries. He has authored more than 350 books, articles and technical papers, and has spoken to thousands of engineers, scientists and executives. And he has given 65 keynote presentations on five continents. His presentation will introduce an entirely new way of thinking about how products are conceived, developed and produced, and give a look to the future at some of the technologies he believes will power this new paradigm.

LOVELAND, Colo., September 28, 2009 – Longview Advisors, organizers of the annual Collaboration & Interoperability Congress (CIC), is proud to announce the 2010 event, which will be held May 3-5 in Estes Park, Colorado.

Registration is now open and encouraged for those dedicated to fostering and enhancing collaboration and interoperability in manufacturing. Visit the conference web site, www.3DCIC.com , to register or to learn more about the event.

Horst was a session organizer (“CAD Manufacturing Interoperability”) and a panel discussion moderator (“I Want My PMI! But How Do I Use It and Benefit From It?”) at CIC09.  He also served throughout 2008 on the conference advisory board.  Even though CIC09 was held during challenging economic times, severely restricting travel, among other things, the conference attendance numbers were close to those in years past, and it appeared that the appropriateness and experience of attendees and speakers were as good as or better than before.  This is surely in part due to the aptness of David Prawel, Longview Associates, as conference organizer.

If you have problems exchanging and managing engineering data in your supply chain, you should have been at Longview's fifth annual Collaboration and Interoperability conference this month. Representatives of major manufacturers talked about some of the world's toughest data management challenges what they're doing to overcome them. (5/21/09) Collaboration & Interoperability Conference 2009